Flip Chip Die Bonder at flip-chip-die-bonder.com

flip-chip-die-bonder.com take pride in offering you Flip Chip Die Bonder solutions as well for your die attach applications as for your Flip Chip applications.

Datacon is one of the leading equipment supplier in the Flip Chip Die Bonder technology. Since its incorporation in 1986, Datacon Semiconductor Equipment GmbH has produced Flip Chip Die Bonder production equipment for the semiconductor industry. A unique new machine platform concept was successfully introduced to the European market in 1995 and to the American and Asian markets in 1998 which transformed Datacon into a global player in the semiconductor industry. Datacon is known for pioneering the concept of modularity and flexibility for the Flip Chip Die Bonder equipment & die attach dispensing market.